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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(2); 2003
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2003;36(2):214-225. Published online: Nov, 30, -0001
언더필 기술
초록
Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Und
키워드 Undefill technology;Flip chip;Chip scale package;Ball grid array;Underfill materials;