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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(5); 2003
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2003;36(5):373-378. Published online: Nov, 30, -0001
Si 웨이퍼의 UBM층 도금두께에 따른 무플럭스 플라즈마 솔더링
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서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;University of Waterloo, 기계공학부;
초록
With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it ca
키워드 Plasma Reflow Soldering;Fluxless Soldering;Lead free Solder;UBM;Shear Strength;Bonded Interface;