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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 36(5); 2003
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2003;36(5):386-392. Published online: Nov, 30, -0001
무연 도금 솔더의 특성 연구: Sn-Cu 및 Sn-Pb 범프의 비교
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서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;
초록
The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm)
키워드 lead-free solder;Sn-Cu;electroplating;microstructure;joint strength;