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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 38(1); 2005
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2005;38(1):28-36. Published online: Nov, 30, -0001
열처리에 따른 구리박막의 리플로우 특성
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경기대학교 재료공학과;한국기술교육대학교 신소재공학과;
초록
In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal org
키워드 Reflow;Copper film;TaN Diffusion Barrier;Pattern filling;Giga DRAM;