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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 38(2); 2005
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2005;38(2):49-54. Published online: Nov, 30, -0001
폴리이미드 종류에 따른 연성 동박 적층판의 부착력 연구
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한국기술교육대학교 신소재공학과;한국기술교육대학교 신소재공학과;
초록
Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializi
키워드 FCCL;SRPI;CRPI;Tie-coating layer;Peel strength;