Aug, 31, 2024

Vol.57 No.4

최신논문 논문목록
논문검색
논문 상세 검색
학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 38(6); 2005
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2005;38(6):216-226. Published online: Nov, 30, -0001

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Sn-Cu 무연 도금용액 및 피막의 신뢰성평가

  • 이홍기;허진영;
    한국생산기술연구원;한국생산기술연구원;
초록

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. Al

키워드 Pb-free;Solder plating;Joint;finishing surface;Reliability;Pb free solder;