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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 41(1); 2008
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2008;41(1):23-27. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2008.41.1.023
용액 교반이 미세 패턴 내 무전해 구리 도금에 미치는 영향
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한국기계연구원 부설 재료연구소 표면기술연구부;한국기계연구원 부설 재료연구소 표면기술연구부;선문대학교 신소재 공학과;
초록
The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitati
키워드 ULSI;Elecroless deposition;Superconformal copper filling;