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KISE Journal of Korean Institute of Surface Engineering 2010;43(2):64-72. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2010.43.2.064
CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted f
키워드 CuSnZn;Alloy plating;CuSn Alloys;Electroplating;Loading test;