Aug, 31, 2024

Vol.57 No.4

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상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 43(3); 2010
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2010;43(3):142-147. Published online: Nov, 30, -0001

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DOI : 10.5695/JKISE.2010.43.3.142

Evaluation of ENEPIG Surface Treatment for High-reliability PCB in Mobile Module

  • Lee, Joon-Kyun;Yim, Young-Min;Seo, Jun-Ho;
    Korea Institute of Industrial Tecnology(KITECH), Surface and Heat Technology R&D Department;Poongwon Chemical;Poongwon Chemical;
초록

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that

키워드 ENIG(electroless Nickel Immersion Gold);ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold);Solder;PCB;MTO;