학회 연락처
- +82-2-563-0935
- +82-2-558-2230
- submission@kssse.or.kr
- https://www.kssse.or.kr/
상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 43(6); 2010
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2010;43(6):289-296. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2010.43.6.289
구리 전기 도금에 Thiourea가 미치는 효과
-
한국기계연구원 부설 재료연구소 융합공정연구본부;한국기계연구원 부설 재료연구소 융합공정연구본부;한국기계연구원 부설 재료연구소 융합공정연구본부;한국기계연구원 부설 재료연구소 융합공정연구본부;
초록
The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni subs
키워드 Cu electroplating;Thiourea;Pulsation;Micro-pattern;