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KISE Journal of Korean Institute of Surface Engineering 2012;45(1):8-14. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2012.45.1.008
The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the
키워드 Polyimide;Electroless copper;Surface modification;Adhesion;