Aug, 31, 2024

Vol.57 No.4

최신논문 논문목록
논문검색
논문 상세 검색
학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 46(4); 2013
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2013;46(4):153-157. Published online: Nov, 30, -0001

PDF

DOI : 10.5695/JKISE.2013.46.4.153

Via-Filling 공정시 발생하는 첨가제 분해에 관한 연구

  • 이민형;조진기;
    한국산업기술대학교, 신소재공학과;한국산업기술대학교, 신소재공학과;
초록

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling pla

키워드 Via-Filling;PEG;SPS;JGB;$Cl^-$;PCB;