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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 46(4); 2013
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2013;46(4):158-161. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2013.46.4.158
전해 Cu Via-Filling 도금에서 염소이온이 가속제와 억제제에 미치는 영향
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한국산업기술대학교 신소재공학과;한국산업기술대학교 신소재공학과;
초록
Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plati
키워드
Via-Filling;