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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 46(4); 2013
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2013;46(4):162-167. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2013.46.4.162
OLED 소자 제조를 위한 주울 가열 봉지 공정 시 도전층 구조에 따르는 열분포
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(주)엔씰텍;홍익대학교 공과대학 신소재 공학과;
초록
Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to enc
키워드 Encapsulation;OLED;Joule-heating;