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KISE Journal of Korean Institute of Surface Engineering 2013;46(6):235-241. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2013.46.6.235
In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lo
키워드 Contact resistance;Nickel diffusion;Au-Ag alloy;Au-Co alloy;Au-Ni alloy;Thermal aging;