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KISE Journal of Korean Institute of Surface Engineering 2014;47(1):1-6. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2014.47.1.001
The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive.
키워드 Pyrophosphate copper plating;Tensile strength;Crystal plane orientation;Ammonium nitrate;electrodeposition copper foil;Inorganic additives;