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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 47(4); 2014
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2014;47(4):162-167. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2014.47.4.162
무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰
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한국생산기술연구원 표면처리연구실용화그룹;한국생산기술연구원 표면처리연구실용화그룹;한국생산기술연구원 표면처리연구실용화그룹;한국생산기술연구원 표면처리연구실용화그룹;
초록
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength usin
키워드 Electroless copper;Adhesion strength;Residual stress;Electrical resistivity;Complexing agent;