학회 연락처
- +82-2-563-0935
- +82-2-558-2230
- submission@kssse.or.kr
- https://www.kssse.or.kr/
KISE Journal of Korean Institute of Surface Engineering 2014;47(5):269-274. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2014.47.5.269
Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on fl
키워드 Electroless plating;Ni plating;Silicone rubber;Electric conductivity;EMI shielding;