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KISE Journal of Korean Institute of Surface Engineering 2014;47(6):303-310. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2014.47.6.303
In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have ob
키워드 thin film;in-situ;stress shift;grain size;E-beam Evaporation;