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- KISE Journal of Korean Institute of Surface Engineering
- Volume 50(3); 2017
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2017;50(3):155-163. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2017.50.3.155
The Stability of Plating Solution and the Current Density Characteristics of the Sn-Ag Plating for the Wafer Bumping
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MSC Co., Ltd.;MSC Co., Ltd.;
초록
In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps` surface. Furthermore the effect of any i
키워드 Solder bump;Sn-Ag alloy;Electroplating;Stability;Purification;