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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 50(3); 2017
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2017;50(3):170-176. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2017.50.3.170
미세피치 플립칩 패키지 구현을 위한 EPIG 표면처리에서의 무전해 팔라듐 피막특성 및 확산에 관한 연구
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한국생산기술연구원;한국생산기술연구원;한국생산기술연구원;한국생산기술연구원;한국생산기술연구원;
초록
EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and g
키워드 Electroless palladium;Immersion gold;Amorphous;Diffusion;Shear strength;