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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 51(1); 2018
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2018;51(1):62-70. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2018.51.1.62
Ni Sulfamate-chloride 전기도금 용액에서 전류밀도와 첨가제의 농도 변화가 Ni 박막에 미치는 영향
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한밭대학교 신소재공학과;한밭대학교 신소재공학과;
초록
Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress
키워드 Electrodeposition;Electroforming process;Additive;Micro-blade;Ni thin film;