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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 51(4); 2018
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2018;51(4):191-196. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2018.51.4.191
혼입불순물이 구리 도금층의 미세조직변화에 미치는 영향
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한국생산기술연구원 표면처리그룹;한국생산기술연구원 표면처리그룹;한국생산기술연구원 표면처리그룹;한국생산기술연구원 표면처리그룹;한국생산기술연구원 표면처리그룹;
초록
The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it ca
키워드 self-annealing;electrodeposition copper foil;evolution of microstructure;crystal orientation;incorporated impurities;