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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 51(5); 2018
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2018;51(5):263-270. Published online: Nov, 30, -0001
DOI : 10.5695/JKISE.2018.51.5.263
은 코팅 구리 덴드라이트 필러 제조 시 은 시드층 형성을 위한 갈바닉 치환반응 pH 제어 및 은함량에 따른 전자파 차폐 특성
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한국세라믹기술원 나노융합소재센터;한국세라믹기술원 나노융합소재센터;한국세라믹기술원 나노융합소재센터;
초록
Ag-coated Cu dendrites were prepared as a filler for an electromagnetic interference shielding application. Ag layers on the Cu dendrites was coated by two approaches. One is a direct autocatalytic plating with a reducing agent. The other approach was ach
키워드 Electromagnetic interference shielding;Ag-coated Cu particle;Galvanic displacement;