Aug, 31, 2024

Vol.57 No.4

학회 연락처

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 53(4); 2020
  • Article

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KISE Journal of Korean Institute of Surface Engineering 2020;53(4):190-199. Published online: Nov, 30, -0001

피로인산동 도금용액으로부터 전기도금 된 Cu 도금층의 물성에 미치는 인가전류밀도의 영향

  • 윤필근;박덕용;
    한밭대학교 신소재공학과;한밭대학교 신소재공학과;
초록

Copper pyrophosphate baths were employed in order to study the dependencies of current efficiency, residual stress, surface morphology and microstructure of electrodeposited Cu thin layers on applied current density. The current efficiency was obtained to

키워드 Electrodeposition;Cu thin layer;pyrophosphate bath;thin film properties;current density;