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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 54(3); 2021
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2021;54(3):158-163. Published online: Jan, 3, 2022
DOI : 10.5695/JKISE.2021.54.3.158
선택적 전기화학 3D 프린터 기술 소개 및 PCB 양산공정 적용방식 고찰
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1애니캐스팅, 2한양대학교 재료화학공학과
초록
Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process,
키워드 Copper, 3D printing, electroplating package