Aug, 31, 2024

Vol.57 No.4

학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 55(2); 2022
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2022;55(2):102-119. Published online: May, 2, 2022

티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성

  • 한재호a,*, 김동현b
    a주식회사 이씨텍, b주식회사 엠에스씨
초록

Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability

키워드 cyanide-free plating; electroless Au plating; Immersion plating; Autocatalytic plating; complexing agent; reducing agent; deposition rate; solderability.