Aug, 31, 2024

Vol.57 No.4

학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 55(5); 2022
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2022;55(5):299-307. Published online: Nov, 14, 2022

비시안 무전해 Au 도금의 석출거동에 미치는 하지층 무전해 Ni-P 도금 조건의 영향

  • 김동현a*, 한재호b
    a주식회사엠에스씨, b주식회사이씨텍
초록

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability

키워드 cyanide-free plating; electroless Au plating; Immersion plating; Autocatalytic plating; deposition rate.