Aug, 31, 2024

Vol.57 No.4

최신논문 논문목록
논문검색
논문 상세 검색
학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 55(6); 2022
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2022;55(6):460-468. Published online: Dec, 29, 2022

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DOI : 10.5695/JSSE.2022.55.6.460

논시안 금도금층의 조직과 경도에 미치는 Tl+ 과 Pd2+ 이온첨가의 영향

  • 허원영, 손인준*
    경북대학교 신소재공학부 금속신소재공학전공
초록

Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plati

키워드 Gold, Electroplating, Gold sulfite, Thallium, Palladium.