학회 연락처
- +82-2-563-0935
- +82-2-558-2230
- submission@kssse.or.kr
- https://www.kssse.or.kr/
KISE Journal of Korean Institute of Surface Engineering 1971;4(1):16-23. Published online: Nov, 30, -0001
In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu
키워드