Aug, 31, 2024

Vol.57 No.4

최신논문 논문목록
논문검색
논문 상세 검색
학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 19(3); 1986
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 1986;19(3):92-108. Published online: Nov, 30, -0001

PDF

국산동판을 사용한 리드프레임 도금기술에 관한 연구

  • 장현구;이대승;
    성균관 대학교 공과대학 금속공학과;성균관 대학교 공과대학 금속공학과;
초록

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of p

키워드