Aug, 31, 2024

Vol.57 No.4

최신논문 논문목록
논문검색
논문 상세 검색
학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 22(2); 1989
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 1989;22(2):47-54. Published online: Nov, 30, -0001

PDF

Sn/Cu 및 Sn/Ni 계면에서 금속간화합물 형성 및 성장에 관한 연구(II)

  • 김홍석;이성래;
    고려대학교 금속공학과;고려대학교 금속공학과;
초록

The effects of intermetallic compound growt on the sheet resistance and soldreability as functions of the aging time, the temperature, and the conditions of substrates have been investi-gated in the electroplallic compound (mainy Cu6Sn5and Ni3Sn4) and the

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