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KISE Journal of Korean Institute of Surface Engineering 1992;25(6):287-292. Published online: Nov, 30, -0001
Silicon nitride thin film (SiNx) was deposited onto the 3inch silicon wafer using an electron cyclotron resonance (ECR) plasma apparatus. The thin films which were deposited by changing the SiH4N2 gas flow rate ratio at 1.5mTorr without substrate heating
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