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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 26(6); 1993
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1993;26(6):327-333. Published online: Nov, 30, -0001
Cu-18wt% Cr 합금박막과 폴리이미드사이의 접착력 : 열처리 영향
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한양대학교 재료공학과;한양대학교 재료공학과;한국과학기술연구원;
초록
The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after he
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