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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 27(2); 1994
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1994;27(2):109-117. Published online: Nov, 30, -0001
초음파 교반을 이용한 기억소자 Metallization용 무전해 Ni Plating
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한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;한양대학교 공과대학 금속공학과;
초록
Effect of ultrasonic agitation on the contact properties was studied in Ni electroless plating and Pd activation. P-type Si bare wafers were used as substrate and DMAB was used as reducing agent due to its good electrical properties, solderability and com
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