Vol.57 No.4
2021 Impact Factor 1.766
5-Year Impact Factor 1.674
KISE Journal of Korean Institute of Surface Engineering 1995;28(1):3-13. Published online: Nov, 30, -0001
Electroless Ni and Cu platings were conducted on $B_4C$ and SiC. In the electroless Ni plating, the deposition rate on $B_4C$ was higher than on SiC. However, the electroless Cu deposition occured with high deposition rate regardle
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