Aug, 31, 2024

Vol.57 No.4

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학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 29(2); 1996
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 1996;29(2):109-119. Published online: Nov, 30, -0001

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Alumina 소지상의 무전해 동도금층의 밀착력에 미치는 안정제의 영향

  • 최순돈;이희록;
    영남대학교 금속공학과;영남대학교 금속공학과;
초록

In order to improve adhesion of electroless copper deposits on alumina substrates, some stabilizers such as 2-Mercapto Benzothiazole, thiourea and NaCN were added over a wide range of concentrations. The adhesion tests of the deposits were performed by

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