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KISE Journal of Korean Institute of Surface Engineering 1996;29(3):157-162. Published online: Nov, 30, -0001
The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the
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