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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 29(3); 1996
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1996;29(3):186-194. Published online: Nov, 30, -0001
Sol-Gel법을 이용한 알루미나 기판과 동 피복층간의 접착력 특성
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충남대학교 공과대학 금속공학과;충남대학교 공과대학 금속공학과;
초록
In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern a
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