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- KISE Journal of Korean Institute of Surface Engineering
- Volume 32(3); 1999
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1999;32(3):211-213. Published online: Nov, 30, -0001
Pb-FREE SOLDER PLATING
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2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.;2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.;
초록
In the future, restrictions are likely to be imposed on the use of lead in the electronics industry. In dealing with such a move, we have been developing Pb-free Sn-Ag plating process to replace presently available Sn-Pb process. In this paper, the result
키워드 Pb-free;Sn-Ag;Meling point;Solderability;Environment-free;