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- KISE Journal of Korean Institute of Surface Engineering
- Volume 32(3); 1999
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1999;32(3):214-218. Published online: Nov, 30, -0001
THE EFFECTS OF ADDITIVES IN NICKEL AND COPPER ELECTROPLATING FOR MICROSTRUCTURE FABRICATION
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Dept. of Metallurgical Engineering and Materials Science Hongik University;Dept. of Metallurgical Engineering and Materials Science Hongik University;
초록
The effect of additives in nickel and copper electroplating were investigated for MEMS applications. Saccharin and gelatin were used as additives in nickel and copper electroplating bath respectively. The morphology and surface hardness of electroplated c
키워드 Electroplating;Nickel;Copper;MEMS;Saccharin;Gelatin;