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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 32(3); 1999
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1999;32(3):289-296. Published online: Nov, 30, -0001
THE RECENT TREND OF BUILD-UP PRINTED CIRCUIT BOARD TECHNOLOGIES
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TAKAGI Associates;
초록
The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density
키워드 Multilayer printed circuit board;Build-up process;Laser drilling;Semi-additive plating;Full-additive plating;