Aug, 31, 2024

Vol.57 No.4

최신논문 논문목록
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상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 32(4); 1999
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 1999;32(4):496-502. Published online: Nov, 30, -0001

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Alloy42 기판 위에 증착된 Ag막의 밀착력에 관한 연구

  • 이철룡;천희곤;조동율;이건환;권식철;
    울산대학교 재료공학과;울산대학교 재료공학과;울산대학교 재료공학과;한국기계연구원;한국기계연구원;
초록

Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associ

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