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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 32(6); 1999
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1999;32(6):647-657. Published online: Nov, 30, -0001
리드프레임/EMC 계면의 파괴 인성치
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한국과학기술원 재료공학과;한국과학기술원 재료공학과;
초록
Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion
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