Aug, 31, 2024

Vol.57 No.4

학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 32(6); 1999
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 1999;32(6):703-708. Published online: Nov, 30, -0001

PDF

열증착법으로 제조된 니켈 모노실리사이드의 미세구조 연구

  • 안영숙;송오성;양철웅;
    서울시립대학교 재료공학과;서울시립대학교 재료공학과;성균관대학교 금속·재료공학부;
초록

Silicides have been used extensively in ULSI logic device fabrication as contact materials for the active areas as well as the poly- Si gates. NiSi is a promising candidate for submicron device application due to less volume expansion, low formation tempe

키워드