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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 32(6); 1999
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 1999;32(6):709-716. Published online: Nov, 30, -0001
ISG법에 의한 금속과 세라믹기판과의 밀착력 향상
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충남대학교 공과대학 금속공학과;충남대학교 공과대학 금속공학과;조선대학교 공과대학 금속공학과;
초록
Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials.
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