Aug, 31, 2024

Vol.57 No.4

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상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 33(4); 2000
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2000;33(4):241-250. Published online: Nov, 30, -0001

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Determination of the Failure Paths of Leadframe/EMC Joints

  • Lee, H.Y.;Kim, S.R.;
    Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology;;
초록

Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adh

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