Aug, 31, 2024

Vol.57 No.4

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  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 34(5); 2001
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2001;34(5):475-480. Published online: Nov, 30, -0001

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Comparative Measurements and Characteristics of Cu Diffusion into Low-Dielectric Constant para-xylene based Plasma Polymer Thin Films

  • Kim, K.J.;Kim, K.S.;Y.C. Jang;Lee, N.E.;Park, J.;D. Jung;
    Department of Materials Engineering and Center for Advanced Plasma Surface Technology Sungkyunkwan University;Department of Materials Engineering and Center for Advanced Plasma Surface Technology Sungkyunkwan University;Department of Materials Engineering
초록

Diffusion of Cu into the low-k para-xylene based plasma polymer (pXPP) thin films deposited by plasma-enhanced chemical vapor deposition using the para-xylene precursor was comparatively measured using various methods. Cu layer was deposited on the surfac

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