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상세보기
- KISE Journal of Korean Institute of Surface Engineering
- Volume 35(1); 2002
- Article
상세보기
KISE Journal of Korean Institute of Surface Engineering 2002;35(1):47-52. Published online: Nov, 30, -0001
Sn3.5Ag0.7Cu 솔더의 계면위치에 따른 금속간 화합물과 강도 연구
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서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;서울시립대학교 신소재공학과;
초록
Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals an
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