Aug, 31, 2024

Vol.57 No.4

학회 연락처

상세보기

  • KISE Journal of Korean Institute of Surface Engineering
  • Volume 35(4); 2002
  • Article

상세보기

KISE Journal of Korean Institute of Surface Engineering 2002;35(4):218-231. Published online: Nov, 30, -0001

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무연솔더합금

  • 이호영;
    서울대학교 기계항공공학부;
초록

As the environmental regulation worldwide emerges, most notably in Europe and Japan, the elimination of Pb usage in electronic assemblies has been an important issue for microelectronics assembly due to the inherent toxicity of Pb. This has provided an im

키워드 Pb-free Solders;properfres of solder alloys;